Hard solder & totally Indium-free die bonding process, which effectively prevents the creep, electeromigration and thermal fatigue of indium solder, has been applied to manifold high power diode lasers based on the CTE matched substrate with high thermal conductivity to enhance its lifetime and reliability.
Optimizing design in packaging structure and using advanced material with high thermal conductivity, effectively improve the ability of heat dissipation to ensure a higher output power.
Theoretically study and analyze the mechanism of thermal stress on the performance of high power diode lasers. Advanced thermal management technology which can lower and homogenize the thermal stress, has been developed to improve the device performance, such as lower smile, higher degree of polarization (DoP) and narrow spectrum.
Develop the specific technology of surface treatment process to enhance the characteristics of surface state of bonding materials for the increase of adhesive strength and long-time reliability of die bonding. Thin film Gold-tin eutectic solder has been developed in house, whose composition can easily to be adjusted for fulfilling the stable and reliable indium-free die bonding.
The performance stability mechanism of high-power diode lasers is improved, and develop the preparation technology of response which greatly improves the reliability and stability.
Beam Transformation System (BTS)
Line Beam Shaping
Wafer-level Laser Optics Manufacturing
The BTS transforms the asymmetrical far field distribution of a diode laser bar into a nearly symmetrical beam parameter product.
Focuslight homogenizers can produce many different beam shapes making it extremely versatile in use.
Shaping and converting one or more beams (up to 12) of symmetrical laser (e.g. Gaussian profile) into an ultra-uniform high-energy density line beam. 750 mm UV-Line system has been used in the most advanced flexible OLED production line in the world, with a uniformity of over 97%.
Based on the wafer-level synchronous structured laser optics manufacturing technology to produce 12-inch (300mm×300mm) glass micro-optics wafers, with nano-level precision refractive microlens array (ROE) technical capabilities, it can meet different application requirements.