Optimizing design in packaging structure and using advanced material with high thermal conductivity effectively improve the ability of heat dissipation to ensure a higher output power.

Theoretical study and analysis of the mechanism of thermal stress on the performance of high-power diode lasers enable us to develop the advanced thermal management technology which can lower and homogenize the thermal stress, and improve the device performance, e.g., lower smile, higher degree of polarization (DoP) and narrower spectrum.

A specific technology of the surface treatment process was developed to enhance the characteristics of the surface state of bonding materials for the increase of adhesive strength and long-time reliability of die bonding. Thin-film Gold-tin eutectic solder has been developed in-house, and the composition can easily be adjusted for fulfilling the stable and reliable indium-free die bonding.

Thanks to our studies on the mechanism of high-power diode laser performance, the optimized structure of the diffusion barrier layer, and the development of the corresponding preparation process technology, the reliability and the stability of the bonding interface have been greatly improved.

A precise micro and nano-optical manufacturing technique for optics components based on silicon and fused silica.
Utilizes photolithography and reactive ion etching (RIE) to achieve accurate shaping, sizing, and positioning.
Enables batch manufacturing of high-precision micro and nano-optical structures on wafers up to 8 inches in size.

Involving precision alignment of custom-designed imprint molds with wafers, polymer micro and nano-optical structures are then imprinted and cured on glass wafers, forming single or double-sided micro and nano lens structures. 
The wafer is subsequently cut into independent arrays of micro and nano lenses according to design requirements. 
This process yields optically stable products with the advantages of low cost and ease of large-scale manufacturing.

The BTS transforms the asymmetrical far-field distribution of a diode laser bar into a nearly symmetrical beam parameter product.

Focuslight homogenizers can produce many different beam shapes, making them extremely versatile in use.

Shaping and conversion of up to 12 symmetrical laser beams (e.g. Gaussian profile) into an ultra-uniform high-energy-density line beam. Our 750 mm UV-Line system has been used in the most advanced flexible OLED production line in the world, with uniformity of over 97%.

Based on wafer-level optics technology, multiple lens wafers can be stacked and then diced into individual micro-optical imaging lenses. WLS enables precise micron-level stacking of optics wafers, and allows for cost-effective integration of additional features like apertures, coatings, and spectral filters, ensuring stability and high performance of the micro-optical products.

Based on wafer-level optics technology, miniature CSP sensors can be added to form a functional module. WLI enhances design flexibility and optimizes real estate usage, offering reflowable solutions tailored for CSP sensors. It features integrated optical filters, advanced anti-reflection technology, and ultra-thin light sealing without barrels or mounts.