2022年度光学技术大赏：DLight S系列半导体集成电路晶圆退火系统

Time：2023-02-22

2023年1月30日，由业界知名媒体光电汇举办的2022中国十大光学产业技术评选最终奖项揭晓，炬光科技DLight S系列半导体集成电路晶圆退火系统荣膺光学类技术奖项。

2023年2月24日，炬光科技受邀出席光电汇“中国十大光学产业技术颁奖典礼及报告会”。在本次报告会中，炬光科技泛半导体制程事业部副总经理顾维一将发表题为《DLight S系列半导体集成电路晶圆退火系统项目概述》的报告。欢迎扫描文章底部海报二维码，免费注册观看！

报告摘要

此次报告将分享半导体集成电路晶圆激光退火的研究背景、应用背景以及国内外技术发展水平。随着半导体制造技术的不断发展和超大规模集成电路设计制造能力的不断提升，激光退火技术逐渐取代传统炉管退火技术，成为28nm及以下逻辑芯片制造前道工序中不可缺少的关键工艺之一。激光退火相对于传统退火，具有选区加热、闭环精准控温、高能量密度、连续能量输出稳定等特点，能够满足多种退火工艺需求。

获奖产品

炬光科技DLight S系列半导体集成电路晶圆退火系统结合了产生光子的共晶键合技术、激光光源热管理技术、热应力控制技术以及调控光子的激光光束转换技术和光场匀化技术，可生成一条线宽70μm，长宽比达160:1的近红外波段极窄线光斑，提供高达1800W/mm²的连续能量输出，在不到1毫秒的时间内将晶圆表层原子层加热到1000°C以上再急速冷却，从而有效减少前道工序中产生的晶圆电极缺陷，提高产品性能，提升晶圆生产良品率。在光斑长度方向上，该专项技术可达到＞95%的光斑均匀性和＞98%的连续输出能量稳定性，同时还具备工艺点温度监测，输出光束质量在线检测等附加功能。其产品核心技术以及独创性已获得业界的广泛认可。

温馨提示：全屏播放效果更佳（时长50秒）

报告人信息

报告人：顾维一，炬光科技泛半导体制程事业部副总经理。毕业于西安工业大学电信学院，工学硕士学位，在激光应用领域有超过十年的从业经验，专注于高功率半导体激光系统在先进制造和泛半导体领域的产品和应用开发，先后主导了炬光科技DLight H、DLight S及Flux H系列高功率半导体激光系统的产品开发。

会议介绍

本次报告将于2月24日（周五）14:10-14:30在线直播，欢迎扫描二维码免费注册报名，我们期待与您在直播间交流探讨！

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2022年度光学技术大赏：DLight S系列半导体集成电路晶圆退火系统

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