Focuslight Releases a New Full Au-Sn Solder Conduction Cooled Single Bar Diode Laser Series, FL-HCS02

Xi’an, China, June 19th, 2014 – Focuslight Technologies announced the releases of a new FL-HCS02 series, a conduction cooled single bar diode laser product using full AuSn solder packaging.  This full AuSn solder packaging technique is not only used between the sub-mount and bars, but it is also used between the sub-mount and heat sink.  As shown in figure 1, this new series includes several wavelength categories: FL-HCS02-50(W)-808(nm), FL-HCS02-50(W)-825(nm)，FL-HCS02-250(W)-808(nm)(QCW) and FL-HCS02-60(W)-9xx(nm) (1) product structure Compared with the previous generation using indium-free hard solder process, the new full AuSn solder packaging has a higher reliability, longer lifetime, better stability, narrower spectrum, lower smile, and great resistance to high temperatures, thermal fatigue, and not easily prone to oxidation. The reliability of this product is expected to have long storage time and stable performance, with the addition of an enhanced performance in reducing electromigration and electric heat transfer. The new full AuSn solder packaging ’s lifetime is 100 times greater compared to laser devices with common conduction cooling under the QCW condition.  This new full AuSn solder approach is currently one of the most advanced packaging techniques in the world. (2) Tendency of lifetime test (3) Condition of lifetime test The FL-HCS02 series products with full AuSn solder packaging is a perfect match  for industrial and scientific research, especially for operations under hard pulse (on and off conditons).  As shown in figure 2 and 3, the product (FL-HCS02-50-825), developed by Focuslight under hard pulse mode, achieved a lifetime test of 8000 hours under the constant current 60A, 90s on and 30s off, at 25℃.  This hard pulse mode tested the effect of anti-thermal fatigue.  Using Indium solder or other soft solder material typically leads to damage to the solder layer.  The result is the Indium solder will re-flow under hard pulse.  Another negative effect is development of voids between chips and heatsink.  The diffusion effect of the thermal conductivity and electrical contact typically resulted in product failure.  Thus, the all new full AuSn solder packaging FL-HCS02-50-825 product solves all these fundamental issue. Main Specifications and Parameters About Focuslight: Founded in 2007, Focuslight Technologies is a fast growing high-tech company committed to research, development and manufacturing of high power diode lasers. Headquartered in Xi’an Shaanxi, China, Focuslight provides products to a variety of customers consisting of OEM, ODM and system integrators worldwide. With its extensive engineering expertise in thermal, optical and mechanical design to die bonding, FAC assembling and fiber coupling to system integration, Focuslight is dedicated to provide customers with well-matched comprehensive solutions for their specific needs. For more information, please visit www.focuslight.com.cn