Industry 1st book on High Power Semiconductor Laser Packaging and Characterization

Xi’an, China, September 30, 2014.  Focuslight is proud to announce Dr. Victor (Xingsheng) Liu’s (CEO and President of Focuslight) newly released book “Packaging of High Power Semiconductor Lasers.” This is not only the first for Dr. Liu and Focuslight but also for Springer, one of top publisher in the industry. The book is a perfect combination of Dr. Liu’s in-depth knowledge and experiences in the packaging of high power semiconductor lasers.  The book includes a comprehensive introduction on high power semiconductor laser packaging technologies, overview on the current developing trends and the challenges of high power semiconductor laser. This is the first book in the world that specialized in high power semiconductor laser packaging.  It will serve not only as a great reference for industry’s professionals and academia, but also for all readers who are interested in the field of diode lasers. The book provides readers with in-depth understanding of high power semiconductor laser on the packaging technology, application and developing trends. The book is available per the attached link：Packaging of High Power Semiconductor Lasers About Focuslight: Founded in 2007, Focuslight Technologies is a fast growing high-tech company committed to research, development and manufacturing of high power diode lasers. Headquartered in Xi’an Shaanxi, China, Focuslight provides products to a variety of customers consisting of OEM, ODM and system integrators worldwide. With its extensive engineering expertise in thermal, optical and mechanical design to die bonding, FAC assembling and fiber coupling to system integration, Focuslight is dedicated to provide customers with well-matched comprehensive solutions for their specific needs. For more information, please visit www.focuslight.com.cn