Wafer-level replication, stacking and singulation ensures scalability and reliability
Ultra-compact form factor: reduced z-height, ideal for slim consumer devices
High imaging quality: low distortion, wide field of view
Customizable optical design: capable of multi-lens stack (2-7 layers typical)
Broad wavelength range: visible to NIR, compatible with CMOS/ToF/structured light sensors
Applications: 3D sensing, AR/VR cameras, AI glass, in-cabin monitoring, disposable endoscopy
Key Specifications
|
Design Format |
2–7 lens elements (wafer-bonded stack) |
|
Wavelength Range |
400 – 1100 nm (VIS–NIR) |
|
Field of View (FOV) |
60° – 120° (typical) |
|
Module Thickness |
< 1 mm to ~3 mm (typical) |
|
Optical Resolution |
Up to 1–2 µm pixel pitch sensors |
|
MTF Performance |
> 50% at Nyquist (typical for VIS range) |
|
Distortion |
< 1–2% (customizable) |
|
Reliability |
–40 °C to +125 °C, reflow-compatible |
|
Applications |
Smartphones, AR/VR imaging, 3D sensing, in-cabin monitoring, biomedical endoscopy |
Applications
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