Manufacturing Engineer (Dicing, Pick & Place)

Job Responsibilities

1. Develop, implement, and refine Dicing and Pick & Place processes for optical wafers, fused silica, silicon, glass, and other applicable substrates or components;
2. Optimize dicing parameters including blade type, spindle speed, feed rate, cut depth, coolant flow, tape selection, mounting, alignment, and cleaning method;
3. Monitor and improve kerf width, edge chipping, cracking, delamination, contamination, die breakage, dimensional accuracy, and post-dicing cleanliness;
4. Develop and optimize Pick & Place recipes including vision alignment, fiducial recognition, pick height, placement force, motion profile, nozzle selection, vacuum settings, and placement coordinates;
5. Ensure stable component pick-up and placement performance, including placement accuracy, orientation, component integrity, surface protection, and traceability;
6. Conduct DOE (Design of Experiments) to improve process capability, throughput, cycle time, yield, and cost;
7. Collaborate with maintenance and equipment teams to operate, troubleshoot, calibrate, and maintain Dicing and Pick & Place equipment and ensure uptime;
8. Collaborate with equipment, blade, tape, tooling, fixture, nozzle, and consumable suppliers for selection, trials, upgrades, troubleshooting, and performance improvement;
9. Implement SPC (Statistical Process Control), control plans, and FMEA (Failure Mode and Effects Analysis) for process control and risk management;
10. Document SOPs, work instructions, process parameters, recipes, inspection criteria, maintenance requirements, and best practices;
11. Conduct root cause analysis and implement CAPA for process excursions, equipment alarms, yield loss, and product damage;
12. Support equipment installation, process qualification, product transfer, sample builds, and production ramp-up at the JB plant;
13. Train production teams and ensure compliance with EHS requirements, clean room protocols, ESD control, machine safety, and approved chemical handling.

Qualifications & Requirements

1. Basic Requirements: Bachelor’s degree or above in Mechanical Engineering, Mechatronics, Materials Science, Manufacturing Engineering, Electrical Engineering, or related fields;
2. Work Experience: Minimum 3 years of hands-on experience in Dicing, die handling, Pick & Place, precision assembly, or related process development and sustaining operations, preferably in optics, semiconductor, MEMS, microelectronics, or precision manufacturing industries;
3. Knowledge and Skills: Hands-on knowledge of wafer/substrate dicing, blade selection, tape mounting, singulation, cleaning, and defect control;
4. Hands-on experience with automated or semi-automated Pick & Place systems, machine vision, fiducial alignment, nozzles/end-effectors, and precision component handling;
5. Ability to interpret drawings, tolerances, inspection criteria, process data, and equipment logs;
6. Familiarity with DOE, SPC, FMEA, control plans, capability analysis, RCA, and CAPA;
7. Analytical problem-solving, documentation discipline, and cross-team communication;
8. Able to work independently and as a team;
9. Familiarity with clean room practices, ESD control, wafer/component handling, and contamination control;
10. Able to work extended periods in ISO-classified clean rooms with PPE and handle approved chemicals and precision instruments;
11. Professional Qualities: Strong teamwork spirit, sense of responsibility, results-oriented mindset, and practical work ethic.